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Dietrich Paulus

Prof. Dr. Dietrich Paulus

Institut für Computervisualistik, Universität Koblenz

Publikationen
Ergebnisse pro Seite:  10

von Gladiss, Anselm; Kramer, Ivanna; Theisen, Nick et al.

Data augmentation for training a neural network for image reconstruction in MPI

International Journal on Magnetic Particle Imaging. Bd. 8. H. 1 Suppl.1. Lübeck: Infinite Science Publishing 2022


Memmesheimer, Raphael; Häring, Simon; Theisen, Nick et al.

Skeleton-DML: Deep Metric Learning for Skeleton-Based One-Shot Action Recognition

Kevin Bowyer;Gérard Medioni;Walter Scheirer;Eric Mortensen (Hrsg). Proceednings of the 2022 IEEE Winter Conference on Applications of Computer Vision WACV 2022: 4–8 January 2022; Waikoloa, Hawaii. Los Alamitos, CA: IEEE Computer Society 2022 S. 837 - 845


Häring, Simon; Memmesheimer, Raphael; Paulus, Dietrich

Action Segmentation on Representations of Skeleton Sequences using Transformer Networks

Saif alZahir;Fabrice Labeau;Kenrick Mock (Hrsg). Proceedings of the 28th IEEE International Conference on Image Processing ICIP 2021: 19–22 September 2021; Anchorage, Alaska, USA. Piscataway, NJ: IEEE Institute of Electrical and Electronics Engineers 2021 S. 3053 - 3057


Helal, Rania A.; Jacob, Roland; Elshinnawy, Maha A. et al.

Cone-beam CT versus Multidetector CT in Postoperative Cochlear Implant Imaging: Evaluation of Image Quality and Radiation Dose

American Journal of Neuroradiology. Bd. 42. H. 2. Oak Brook, Il.: American Society of Neuroradiology 2021 S. 362 - 367


Kramer, Ivanna; Memmesheimer, Raphael; Paulus, Dietrich

Customer Interaction of a Future Convenience Store with a Mobile Manipulation Service Robot

Farshad Firouzi;Krishnendu Chakrabarty;Bahar Farahani;Naghmeh Karimi;Hadi Heidari;Vasilis Pavlidis (Hrsg). Proceedings of the IEEE International Conference on Omni-layer Intelligent Systems COINS 2021: 23 August - 26 August 2021; Barcelona, Spain. Piscataway, NJ: IEEE Institute of Electrical and Electronics Engineers 2021 S. 250 - 256


Abayev, Roman; von Gladiss, Anselm; Paulus, Dietrich

Eigenschaften verschiedener Solid-State-LIDAR-Systeme

Stephan Rothstock;Benjamin Hohnhäuser;Daniel Krueger;Michael Pochanke (Hrsg). 3D-NordOst 2021: Tagungsband 23. Anwendungsbezogener Workshop zur Erfassung, Modellierung, Verarbeitung und Auswertung von 3D-Daten; Berlin; 02. - 03. Dezember 2021. Berlin: GFaI Gesellschaft zur Förderung angewandter Informatik 2021 S. 19 - 27


Duhme, Michael; Memmesheimer, Raphael; Paulus, Dietrich

Fusion-GCN: Multimodal Action Recognition using Graph Convolutional Networks

Christian Bauckhage;Juergen Gall;Alexander Schwing (Hrsg). Pattern Recognition: 43rd DAGM German Conference, DAGM GCPR 2021, Bonn, Germany, September 28 – October 1, 2021, Proceedings. Gorgan: Gorgan University of Agricultural Sciences and Natural Resources 2021 S. 265 - 281


Kuhlmann, Isabelle; Seib, Viktor; Paulus, Dietrich

Integrating Feedforward Design into a Generative Network to Synthesize Supplementary Training Data for Object Classification

Vitor Santos;Nuno Lau;Pedro Neto;Ana Cristina Lopes (Hrsg). Proceedings of the IEEE International Conference on Autonomous Robot Systems and Competitions ICARSC 2021: April 28-29, 2021; Santa Maria da Feira, Portugal. Piscataway, NJ: IEEE Institute of Electrical and Electronics Engineers 2021 S. 215 - 220


Seib, Viktor; Paulus, Dietrich

Object Detection in Cluttered Environments With Sparse Keypoint Selection

Tamara Berg;James Clark;Yasuyuki Matsushita;Camillo J. Taylor (Hrsg). Proceedings of the IEEE/CVF International Conference on Computer Vision Workshops ICCVW 2021: 11–17 October 2021; Virtual Event. Los Alamitos, CA: IEEE Computer Society 2021 S. 2496 - 2505


Seib, Viktor; Paulus, Dietrich

Shortened Color-Shape Descriptors for Point Cloud Classification from RGB-D Cameras

Vitor Santos;Nuno Lau;Pedro Neto;Ana Cristina Lopes (Hrsg). Proceedings of the IEEE International Conference on Autonomous Robot Systems and Competitions ICARSC 2021: April 28-29, 2021; Santa Maria da Feira, Portugal. Piscataway, NJ: IEEE Institute of Electrical and Electronics Engineers 2021 S. 203 - 208