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Microstrip CAD models including surface wave coupling

6th European Conference on Antennas and Propagation (EUCAP), 2012. IEEE: IEEE 2012

Erscheinungsjahr: 2012

ISBN/ISSN: 2164-3342

Publikationstyp: Diverses (Konferenzbeitrag)

Sprache: Deutsch

Doi/URN: 10.1109/EuCAP.2012.6206420

Volltext über DOI/URN

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Inhaltszusammenfassung


Today, the majority of RF and microwave circuits is realized in planar technologies like RF PCB, MIC (microwave integrated circuits) and LTCC (low temperature cofired ceramics). These techniques use planar dielectric carriers (substrates) with metallizations, mostly one side is totally metallized as the ground plane. The substrate can guide surface waves, particularly the fundamental surface mode TMz0 that has a zero cut-off frequency (fcuto f f=0Hz) and is always present. The amount of power...Today, the majority of RF and microwave circuits is realized in planar technologies like RF PCB, MIC (microwave integrated circuits) and LTCC (low temperature cofired ceramics). These techniques use planar dielectric carriers (substrates) with metallizations, mostly one side is totally metallized as the ground plane. The substrate can guide surface waves, particularly the fundamental surface mode TMz0 that has a zero cut-off frequency (fcuto f f=0Hz) and is always present. The amount of power transferred into a surface wave mode increases linearly at low frequencies, so their effects are only negligible up to their gradual onset, depending on substrate dielectric constant, thickness and the specific discontinuity. Analytical models for microstrip circuit elements are available in commercial CAD tools. To verify electromagnetic (EM) coupling in these circuits, commercial fullwave-solvers, based on different simulation approaches (FEM, FDTD, PEEC, MoM, SDA, TLM, etc.) are well-proven. Most of these approaches are capable to account for surface waves implicitely (except PEEC), but all of them are very time-consuming. The above mentioned analytical CAD models are not able to handle coupling by surface waves. The power of this kind of guided radiation decreases along the surface with 1/r in contrast to freespace-radiation (1/r2). Therefore, surface wave radiation has a far reaching effect, causes performance perturbation and is the main cause responsible for coupling phenomena » weiterlesen» einklappen

  • Surface waves
  • Microstrip
  • Solid modeling
  • Couplings
  • Microwave circuits
  • Surface impedance

Klassifikation


DFG Fachgebiet:
Elektrotechnik und Informationstechnik

DDC Sachgruppe:
Technik

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